Invention Grant
- Patent Title: Semiconductor memory device and manufacturing method thereof
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US11826089Application Date: 2007-07-12
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Publication No.: US07737480B2Publication Date: 2010-06-15
- Inventor: Ryo Nakagawa , Takashi Nakabayashi , Hideyuki Arai
- Applicant: Ryo Nakagawa , Takashi Nakabayashi , Hideyuki Arai
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-217222 20060809
- Main IPC: H01L31/062
- IPC: H01L31/062

Abstract:
A semiconductor memory device includes: a transistor formed in a substrate; a capacitor formed above one of source/drain regions of the transistor; a bit line formed above the substrate and extending in the gate length direction of the transistor; a first conductive plug connecting one of the source/drain regions and the capacitor; a second conductive plug connected to the other source/drain region that is not connected to the first conductive plug; and a third conductive plug formed on the second conductive plug and connected to the bit line. The central axis of the third conductive plug is displaced from the central axis of the second conductive plug in the gate width direction of the transistor.
Public/Granted literature
- US20080035975A1 Semiconductor memory device and manufacturing method thereof Public/Granted day:2008-02-14
Information query
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