Invention Grant
- Patent Title: Multi-surface IC packaging structures and methods for their manufacture
- Patent Title (中): 多表面IC封装结构及其制造方法
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Application No.: US11353564Application Date: 2006-02-13
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Publication No.: US07737545B2Publication Date: 2010-06-15
- Inventor: Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Kevin P. Grundy
- Applicant: Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Inessa Obenhuber, legal representative , Kevin P. Grundy
- Applicant Address: US CA Cupertino
- Assignee: Interconnect Portfolio LLC
- Current Assignee: Interconnect Portfolio LLC
- Current Assignee Address: US CA Cupertino
- Agent Ronald R. Shea, Esq.
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
Public/Granted literature
- US20060157846A1 Multi-surface IC packaging structures and methods for their manufacture Public/Granted day:2006-07-20
Information query
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