Semiconductor die package including heat sinks

Invention Grant

US07737548B2 Semiconductor die package including heat sinks 有权

Title translation: 半导体封装包括散热片

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Patent Title: Semiconductor die package including heat sinks
Patent Title (中): 半导体封装包括散热片
Application No.: US11847001

Application Date: 2007-08-29
Publication No.: US07737548B2

Publication Date: 2010-06-15
Inventor: Jocel P. Gomez
Applicant: Jocel P. Gomez
Applicant Address: US ME South Portland
Assignee: Fairchild Semiconductor Corporation
Current Assignee: Fairchild Semiconductor Corporation
Current Assignee Address: US ME South Portland
Agency: Townsend and Townsend and Crew LLP
Main IPC: H01L23/10
IPC: H01L23/10

Semiconductor die package including heat sinks

Abstract:

A semiconductor die package including at least two heat sinks. The semiconductor die package includes a first heat sink, a second heat sink coupled to the first heat sink, and a semiconductor die between the first heat sink and the second heat sink. The semiconductor die is electrically coupled to the first heat sink and the second heat sink. The semiconductor die may also be attached to a lead.

Abstract(Chinese):

一种包括至少两个散热器的半导体管芯封装。半导体管芯封装包括第一散热器，耦合到第一散热器的第二散热器以及第一散热器和第二散热器之间的半导体管芯。半导体管芯电耦合到第一散热器和第二散热器。半导体管芯也可以附着在引线上。

Public/Granted literature

US20090057878A1 SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS Public/Granted day:2009-03-05

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）
H01L23/10	..按部件间，例如在容器的帽盖和基座之间或在容器的引线和器壁之间的封接的材料或配置的特点进行区分的