Invention Grant
- Patent Title: Optimization of electronic package geometry for thermal dissipation
- Patent Title (中): 用于散热的电子封装几何的优化
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Application No.: US11847716Application Date: 2007-08-30
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Publication No.: US07737550B2Publication Date: 2010-06-15
- Inventor: Stephen W. MacQuarrie , Scott P. Moore
- Applicant: Stephen W. MacQuarrie , Scott P. Moore
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Carl Lanuti, Esq.
- Main IPC: H01L23/43
- IPC: H01L23/43 ; H01L21/00
Abstract:
An electronic package device is disclosed including a microelectronic package and a heat sink positioned over the microelectronic package. A thermal interface element is positioned between the microelectronic package and the heat sink. The thermal interface element is elongated and has differing thicknesses along its length to enhance the dissipation of heat.
Public/Granted literature
- US20090059537A1 OPTIMIZATION OF ELECTRONIC PACKAGE GEOMETRY FOR THERMAL DISSIPATION Public/Granted day:2009-03-05
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