Invention Grant
- Patent Title: Method and apparatus for wafer marking
- Patent Title (中): 晶圆标记方法及装置
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Application No.: US12143197Application Date: 2008-06-20
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Publication No.: US07737567B2Publication Date: 2010-06-15
- Inventor: Anthony C. Bonora , Raymond S. Martin , Michael Krolak
- Applicant: Anthony C. Bonora , Raymond S. Martin , Michael Krolak
- Applicant Address: US CA Fremont
- Assignee: Crossing Automation, Inc.
- Current Assignee: Crossing Automation, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla & Gencarella, LLP
- Main IPC: H01L23/544
- IPC: H01L23/544 ; B65H1/00

Abstract:
A semiconductor substrate is provided. The substrate includes a first surface and an opposing second surface, wherein the first surface includes a marking in a centroid region of the first surface. The marking indicates a location of a center point on the first surface of the semiconductor substrate or identification data unique to the substrate. A system, methods of transporting and marking, and a device for reading the substrate markings are also provided.
Public/Granted literature
- US20090001616A1 METHOD AND APPARATUS FOR WAFER MARKING Public/Granted day:2009-01-01
Information query
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