Invention Grant
- Patent Title: Printed circuit board connection
- Patent Title (中): 印刷电路板连接
-
Application No.: US12152542Application Date: 2008-05-14
-
Publication No.: US07740486B2Publication Date: 2010-06-22
- Inventor: Nagahisa Watanabe
- Applicant: Nagahisa Watanabe
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2005-138698 20050511
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electronic device, comprising an improved printed circuit board connection for connecting a first printed circuit board to a second printed circuit board in a manner that permits physical engagement at a different position than the electrical engagement, and a method for making the improved printed circuit board connection with precision in alignment. In one embodiment, the first printed circuit board includes an end portion configured to engage with a member of a connector on the second printed circuit board. The end portion and the member engage along concave portions of the end portion and convex portions of the member. When engaged, the end portion and the member align wires of the first printed circuit board with terminals of the connector.
Public/Granted literature
- US20080227313A1 Printed circuit board connection Public/Granted day:2008-09-18
Information query