Invention Grant
- Patent Title: Polycrystalline SiGe Junctions for advanced devices
- Patent Title (中): 多晶SiGe接头用于先进设备
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Application No.: US12118776Application Date: 2008-05-12
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Publication No.: US07741165B2Publication Date: 2010-06-22
- Inventor: Kevin Kok Chan , Robert J. Miller , Erin C. Jones , Atul Ajmera
- Applicant: Kevin Kok Chan , Robert J. Miller , Erin C. Jones , Atul Ajmera
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent George Sai-Halasz
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234

Abstract:
A structure and method of fabrication for MOSFET devices with a polycrystalline SiGe junction is disclosed. Ge is selectively grown on Si while Si is selectively grown on Ge. Alternating depositions of Ge and Si layers yield the SiGe junction. The deposited layers are doped, and subsequently the dopants outdiffused into the device body. A thin porous oxide layer between the polycrystalline Ge and Si layers enhances the isotropy of the SiGe junctions.
Public/Granted literature
- US20080248635A1 Polycrystalline SiGe Junctions for Advanced Devices Public/Granted day:2008-10-09
Information query
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