Invention Grant
- Patent Title: Identifying process and temperature of silicon chips
- Patent Title (中): 识别硅片的工艺和温度
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Application No.: US10750342Application Date: 2003-12-31
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Publication No.: US07742887B2Publication Date: 2010-06-22
- Inventor: Jagrut Viliskumar Patel , Martin Vyungchon Choe , Ziad Mansour
- Applicant: Jagrut Viliskumar Patel , Martin Vyungchon Choe , Ziad Mansour
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Jiayu Xu
- Main IPC: G01R23/00
- IPC: G01R23/00
Abstract:
Systems and techniques are disclosed relating to communications. The systems and techniques include determining the temperature and process speed of chips used in communications devices. The systems and techniques include measuring the output of ring oscillators embedded in the chips, and calculating the temperature and process speed therefrom.
Public/Granted literature
- US20050114056A1 Identifying process and temperature of silicon chips Public/Granted day:2005-05-26
Information query
