Invention Grant
- Patent Title: Printed circuit board having vias
- Patent Title (中): 具有通孔的印刷电路板
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Application No.: US11478922Application Date: 2006-06-30
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Publication No.: US07745737B2Publication Date: 2010-06-29
- Inventor: Yu-Hsu Lin , Shang-Tsang Yeh , Chao-Chen Huang , Chuan-Bing Li
- Applicant: Yu-Hsu Lin , Shang-Tsang Yeh , Chao-Chen Huang , Chuan-Bing Li
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Zhigang Ma
- Priority: CN200510035782 20050702
- Main IPC: H01R12/04
- IPC: H01R12/04 ; H05K1/11 ; H01K3/22

Abstract:
A printed circuit board (PCB) having vias for reducing reflections of input signals includes a first signal layer, a second signal layer, one via, an input signal line arranged on the first signal layer, and an output signal line arranged on the second signal layer. The via further includes a drill hole, a first pad, and a second pad. The first pad is electrically connected with the input signal line, and the second pad is electrically connected with the output signal line. An outer diameter of the first pad is smaller than an outer diameter of the second pad.
Public/Granted literature
- US20070000691A1 Printed circuit board having vias Public/Granted day:2007-01-04
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