Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11360808Application Date: 2006-02-24
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Publication No.: US07745915B2Publication Date: 2010-06-29
- Inventor: Motoo Suwa , Hikaru Ikegami , Takafumi Betsui
- Applicant: Motoo Suwa , Hikaru Ikegami , Takafumi Betsui
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2005-051556 20050225
- Main IPC: H01L23/02
- IPC: H01L23/02

Abstract:
A mounting board has a plurality of semiconductor memory devices operated in sync with a clock signal, and a semiconductor data processing device which access-controls the semiconductor memory devices. Layouts of data-system terminals of the semiconductor memory devices with respect to memory access terminals of the semiconductor data processing device are determined in such a manner that wirings for data and a data strobe system (RTdq/dqs) become shorter than wirings for a command/address system (RTcmd/add). The wirings for the data and data strobe system (RTdq/dqs) are laid down using an area defined between the semiconductor memory devices. The wirings for the command/address system (RTcmd/add) bypass the side of the mounting board.
Public/Granted literature
- US20060192282A1 Semiconductor device Public/Granted day:2006-08-31
Information query
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