Invention Grant
US07746661B2 Printed circuit board with coextensive electrical connectors and contact pad areas
有权
印刷电路板，具有相同的电连接器和接触垫区域
- Patent Title: Printed circuit board with coextensive electrical connectors and contact pad areas
- Patent Title (中): 印刷电路板，具有相同的电连接器和接触垫区域
-
Application No.: US11449493Application Date: 2006-06-08
-
Publication No.: US07746661B2Publication Date: 2010-06-29
- Inventor: Chih-Chin Liao , Han-Shiao Chen , Chin-Tien Chiu , Ken Jian Ming Wang , Cheemen Yu , Hem Takiar
- Applicant: Chih-Chin Liao , Han-Shiao Chen , Chin-Tien Chiu , Ken Jian Ming Wang , Cheemen Yu , Hem Takiar
- Applicant Address: US CA Milpitas
- Assignee: SanDisk Corporation
- Current Assignee: SanDisk Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Vierra Magen Marcus & DeNiro LLP
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
Public/Granted literature
- US20070284727A1 Printed circuit board with coextensive electrical connectors and contact pad areas Public/Granted day:2007-12-13
Information query
