Invention Grant
- Patent Title: Filtered feedthrough assembly and method of manufacture
- Patent Title (中): 过滤馈通组件及其制造方法
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Application No.: US11872452Application Date: 2007-10-15
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Publication No.: US07748093B2Publication Date: 2010-07-06
- Inventor: Rajesh V. Iyer , Susan A. Tettemer , John P. Tardiff , Shawn D. Knowles
- Applicant: Rajesh V. Iyer , Susan A. Tettemer , John P. Tardiff , Shawn D. Knowles
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: H01G7/00
- IPC: H01G7/00

Abstract:
A filtered feedthrough assembly having at least one terminal pin therethrough is provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.
Public/Granted literature
- US20080033496A1 FILTERED FEEDTHROUGH ASSEMBLY AND METHOD OF MANUFACTURE Public/Granted day:2008-02-07
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