Invention Grant
- Patent Title: Molding installation method and device
- Patent Title (中): 成型安装方法和装置
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Application No.: US11720446Application Date: 2005-11-24
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Publication No.: US07748094B2Publication Date: 2010-07-06
- Inventor: Tatsuhiko Yamamoto , Takahiro Yogoro
- Applicant: Tatsuhiko Yamamoto , Takahiro Yogoro
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2004-345174 20041130
- International Application: PCT/JP2005/021513 WO 20051124
- International Announcement: WO2006/059521 WO 20060608
- Main IPC: B23P19/04
- IPC: B23P19/04 ; B60J10/00

Abstract:
A device capable of smoothly, easily and automatically installing a molding on a door panel for an automobile is provided and includes a molding installation jig and a dynamic sensor located between a jig body and an arm. The dynamic sensor is designed to detect a force applied from the molding installation jig to the molding. A finger is supported on a side of the jig body to contact and hold an end section of the molding. Three suction pads, which communicate with a vacuum device, are provided on a surface of the jig body at equal intervals. A pair of brackets having a C-shaped cross section are provided on a side surface of the jig body, which is perpendicular to the surface on which the suction pads are provided. A first roller, a second roller, and a third roller 19 are rotatably supported in each of the brackets.
Public/Granted literature
- US20080047119A1 Molding Installation Method And Device Public/Granted day:2008-02-28
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