Invention Grant
- Patent Title: Liquid cooling system
- Patent Title (中): 液体冷却系统
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Application No.: US12046995Application Date: 2008-03-12
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Publication No.: US07748229B2Publication Date: 2010-07-06
- Inventor: Paul J. Gwin , Brian J. Long
- Applicant: Paul J. Gwin , Brian J. Long
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Robert D. Anderson
- Main IPC: F25D23/12
- IPC: F25D23/12
Abstract:
In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.
Public/Granted literature
- US20080148757A1 LIQUID COOLING SYSTEM Public/Granted day:2008-06-26
Information query
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