Invention Grant
- Patent Title: Packaged body
- Patent Title (中): 包装体
-
Application No.: US12084905Application Date: 2006-10-11
-
Publication No.: US07748539B2Publication Date: 2010-07-06
- Inventor: Takehito Onda , Seiya Nakamura
- Applicant: Takehito Onda , Seiya Nakamura
- Applicant Address: JP Chuo-Ku, Tokyo
- Assignee: Shin-Etsu Polymer Co., Ltd.
- Current Assignee: Shin-Etsu Polymer Co., Ltd.
- Current Assignee Address: JP Chuo-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2005-331869 20051116
- International Application: PCT/JP2006/320319 WO 20061011
- International Announcement: WO2007/058034 WO 20070524
- Main IPC: B65D85/30
- IPC: B65D85/30 ; B65D81/33

Abstract:
A packaged body includes: a prism-shaped packaging box 1 having a bottom; a pair of top and bottom shock absorbers 30 accommodated inside packaging box 1 for sandwiching a substrate storage container 10; elastic members 50 disposed between substrate storage container 10 and each shock absorber 30; and reinforcements 60 for reinforcing each of shock absorbers 30. Further, shock absorber 30 is formed as a shock absorbing element 31 that fits substrate storage container 10, a surrounding wall 32 of the shock absorbing element 31 is constructed of an inner wall 35 that is bent and formed along the periphery of shock absorbing element 31, a protrusion 36 that is formed from inner wall 35 so as to project outwards and an outer wall 37 that is formed from protrusion 36 so as to be spaced from, and oppose, inner wall 35 of shock absorbing element 31.
Public/Granted literature
- US20090166248A1 Packaged Body Public/Granted day:2009-07-02
Information query
IPC分类: