The present invention relates to an apparatus and a method for hot bonding metal plates having advantages that removing an oxidation film of the metal plates and bonding the metal plates are simultaneously accomplished and a bonding force between the metal plates is enhanced by applying a strong bonding pressure to the metal plates. The present invention has advantages that overlapped metal plates are compressed vertically and a shaving blade is formed at a shaving mold. Therefore, as the metal plates move, an oxidation film coated on the overlapped surfaces of the metal plates is removed. In addition, a home is formed at the shaving mold so that excess metal together with an oxidation film coated on front portions of the metal plates are removed and simultaneously the metal plates are bonded with a strong pressure.