Invention Grant
- Patent Title: Non-contact IC module
- Patent Title (中): 非接触式IC模块
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Application No.: US12013339Application Date: 2008-01-11
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Publication No.: US07748638B2Publication Date: 2010-07-06
- Inventor: Yoshiharu Hino , Kazuhiko Daido
- Applicant: Yoshiharu Hino , Kazuhiko Daido
- Applicant Address: JP Ibaraki-shi
- Assignee: Hitachi Maxwell, Ltd.
- Current Assignee: Hitachi Maxwell, Ltd.
- Current Assignee Address: JP Ibaraki-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2000-019042 20000127; JP2000-046325 20000223
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.
Public/Granted literature
- US20080117118A1 NON-CONTACT IC MODULE Public/Granted day:2008-05-22
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