Invention Grant
- Patent Title: Linking device having connecting member with thermal deformation absorbing structure
- Patent Title (中): 具有连接构件的连接装置具有热变形吸收结构
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Application No.: US11890709Application Date: 2007-08-07
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Publication No.: US07748641B2Publication Date: 2010-07-06
- Inventor: Tomohiro Sudoh
- Applicant: Tomohiro Sudoh
- Applicant Address: JP Kariya
- Assignee: DENSO Corporation
- Current Assignee: DENSO Corporation
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2006-217305 20060809
- Main IPC: G05D23/02
- IPC: G05D23/02
Abstract:
A linking device has a connecting member for connecting a first rotation member and a second rotation member. The connecting member is connected to the first rotation member at a first connecting point and to the second rotation member at a second connecting point. The connecting member includes a thermal deformation absorbing part between the first connecting point and the second connecting point, and is adapted to absorb a change of distance between the first connecting point and the second connecting point due to thermal deformation.
Public/Granted literature
- US20080035745A1 Linking device having connecting member with thermal deformation absorbing structure Public/Granted day:2008-02-14
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