Invention Grant
US07748824B2 Ejecting apparatus, applying method, manufacturing method of color filter substrate, manufacturing method of electroluminescence display apparatus, manufacturing method of plasma display apparatus, and manufacturing method of wire
有权
喷射装置，涂布方法，滤色器基板的制造方法，电致发光显示装置的制造方法，等离子体显示装置的制造方法以及线的制造方法
- Patent Title: Ejecting apparatus, applying method, manufacturing method of color filter substrate, manufacturing method of electroluminescence display apparatus, manufacturing method of plasma display apparatus, and manufacturing method of wire
- Patent Title (中): 喷射装置，涂布方法，滤色器基板的制造方法，电致发光显示装置的制造方法，等离子体显示装置的制造方法以及线的制造方法
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Application No.: US10965005Application Date: 2004-10-14
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Publication No.: US07748824B2Publication Date: 2010-07-06
- Inventor: Masasyuki Tashiro , Mitsuru Kuribayashi
- Applicant: Masasyuki Tashiro , Mitsuru Kuribayashi
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2003-355257 20031015
- Main IPC: B41J2/15
- IPC: B41J2/15
Abstract:
An ejecting apparatus is provided for readily controlling ejection even when the number of nozzles is increased. In each of N heads in an ejecting apparatus, DA equals a distance between a first nozzle array and a second nozzle array, and a distance between the second nozzle array in one arbitrary head of the N heads and the first nozzle array in another head adjacent to this arbitrary head in the Y-axis direction is substantially equal to an integer multiple of DA.
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