Invention Grant
- Patent Title: Thermal analysis equipment
- Patent Title (中): 热分析设备
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Application No.: US11661638Application Date: 2005-08-26
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Publication No.: US07748894B2Publication Date: 2010-07-06
- Inventor: Rintaro Nakatani
- Applicant: Rintaro Nakatani
- Applicant Address: JP
- Assignee: SII NanoTechnology Inc.
- Current Assignee: SII NanoTechnology Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2004-257133 20040903
- International Application: PCT/JP2005/015505 WO 20050826
- International Announcement: WO2006/025268 WO 20060309
- Main IPC: G01J5/00
- IPC: G01J5/00 ; G01N25/20 ; G01J1/00

Abstract:
A thermal analysis equipment includes a thermal analysis data preservation function that preserves, as thermal analysis data, signals from a temperature sensor and a physical quantity sensor that detect a temperature and a change in physical quantity, respectively, of a sample. An electromagnetic-wave data acquisition control function controls acquisition of electromagnetic wave data in accordance with setting of a trigger to acquire the electromagnetic wave data. An electromagnetic-wave data preservation function preserves the electromagnetic wave data. An electromagnetic-wave data correlation function correlates the preserved electromagnetic wave data to a position on the thermal analysis data when the trigger is set.
Public/Granted literature
- US20080025367A1 Thermal Analysis Equipment Public/Granted day:2008-01-31
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