Invention Grant
- Patent Title: Molding die
- Patent Title (中): 成型模具
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Application No.: US11889589Application Date: 2007-08-15
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Publication No.: US07748975B2Publication Date: 2010-07-06
- Inventor: Kenji Kitayama , Nobuyuki Ohji , Shogo Tomiyama
- Applicant: Kenji Kitayama , Nobuyuki Ohji , Shogo Tomiyama
- Applicant Address: JP Osaka-Shi
- Assignee: Daicel Chemical Industries, Ltd.
- Current Assignee: Daicel Chemical Industries, Ltd.
- Current Assignee Address: JP Osaka-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-230325 20060828
- Main IPC: B29C45/02
- IPC: B29C45/02 ; B29C45/03 ; D01D5/24

Abstract:
The present invention relates to a molding die for molding a hollow molding article, including: a pin plate having an inflow port for molding material, a tubular bushing forming a molding path continued from the inflow port, an outlet of the die positioned in the extending direction of the molding path, a conical pin provided perpendicularly to the pin plate and disposed inside the molding path, a gap, that is continuous in the longitudinal direction, being provided between an inner wall surface of the molding path and an outer surface of the conical pin, an adjusting device for adjusting a width of a standard annular gap when a gap formed between a specified position in the longitudinal direction of the molding path and the outer surface of the conical pin opposing to the position.
Public/Granted literature
- US20080048356A1 Molding die Public/Granted day:2008-02-28
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