Invention Grant
- Patent Title: Method for fabricating bulb-shaped recess pattern
- Patent Title (中): 制造灯泡形凹槽图案的方法
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Application No.: US11748617Application Date: 2007-05-15
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Publication No.: US07749912B2Publication Date: 2010-07-06
- Inventor: Myung-Ok Kim , Tae-Hyoung Kim
- Applicant: Myung-Ok Kim , Tae-Hyoung Kim
- Applicant Address: KR Ichon-shi, Kyoungki-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Ichon-shi, Kyoungki-do
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: KR10-2007-0000749 20070103
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
A method for fabricating a bulb-shaped recess pattern includes: forming an etch barrier layer over a substrate; forming a hard mask pattern in which a first polymer is attached to sidewalls of the hard mask pattern over the etch barrier layer; sequentially etching the etch barrier layer and the substrate to form a recess pattern in which a second polymer is attached to sidewalls of the recess pattern; removing the first and second polymers and the hard mask pattern; forming a plurality of spacers exposing a bottom portion of the recess pattern; and etching the exposed bottom portion of the recess pattern to form a ball pattern.
Public/Granted literature
- US20080160766A1 METHOD FOR FABRICATING BULB-SHAPED RECESS PATTERN Public/Granted day:2008-07-03
Information query
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