Invention Grant
- Patent Title: Distributive conductor
- Patent Title (中): 分布导体
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Application No.: US11887761Application Date: 2006-04-28
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Publication No.: US07750241B2Publication Date: 2010-07-06
- Inventor: Kunihiko Watanabe
- Applicant: Kunihiko Watanabe
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-132182 20050428
- International Application: PCT/JP2006/309036 WO 20060428
- International Announcement: WO2006/118273 WO 20061109
- Main IPC: H01B7/00
- IPC: H01B7/00
Abstract:
A distributive conductor electromagnetically shields and protects an insulated wire 10 by inserting it into a pipe 20. Heat generated in the insulated wire 10 is absorbed into a low heat-reflective layer 21 of lower heat reflectivity, transferred to the pipe 20, and then dissipated from an outer circumferential wall of the pipe 20 to atmosphere.
Public/Granted literature
- US20090095525A1 Distributive Conductor Public/Granted day:2009-04-16
Information query
