Invention Grant
- Patent Title: Back-illuminated image sensor and method of fabricating the same
- Patent Title (中): 背照式图像传感器及其制造方法
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Application No.: US11987607Application Date: 2007-12-03
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Publication No.: US07750280B2Publication Date: 2010-07-06
- Inventor: Sung-Ho Hwang , Duck-Hyung Lee , Chang-Rok Moon , Doo-Won Kwon
- Applicant: Sung-Ho Hwang , Duck-Hyung Lee , Chang-Rok Moon , Doo-Won Kwon
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics, Co., Ltd.
- Current Assignee: Samsung Electronics, Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, L.L.C.
- Priority: KR10-2006-0121671 20061204
- Main IPC: B05D5/12
- IPC: B05D5/12

Abstract:
A back-illuminated image sensor may include a substrate in which photodiodes are disposed; an insulating layer on a first surface of the substrate; an interconnection layer in the insulating layer; an anti-reflection layer between the substrate and the insulating layer; a plurality of color filters on a second surface of the substrate opposite to the first surface; and a microlens on the color filters. Because the anti-reflection layer may be between the substrate and an interlayer dielectric layer, the reflection rate of light that passes through the substrate and arrives at an interface between the substrate and the interlayer insulating layer may be reduced.
Public/Granted literature
- US20080131588A1 Back-illuminated image sensor and method of fabricating the same Public/Granted day:2008-06-05
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