Invention Grant
- Patent Title: Nitride semiconductor device
- Patent Title (中): 氮化物半导体器件
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Application No.: US12213005Application Date: 2008-06-12
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Publication No.: US07750369B2Publication Date: 2010-07-06
- Inventor: Hiroaki Ohta , Hirotaka Otake
- Applicant: Hiroaki Ohta , Hirotaka Otake
- Applicant Address: JP Kyoto
- Assignee: ROHM Co., Ltd.
- Current Assignee: ROHM Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2007-156458 20070613
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A nitride semiconductor device according to the present invention includes: a nitride semiconductor laminated structure comprising a first layer made of a Group III nitride semiconductor, a second layer laminated on the first layer and made of an Al-containing Group III nitride semiconductor with a composition that differs from that of the first layer, the nitride semiconductor laminated structure comprising a stripe-like trench exposing a lamination boundary between the first layer and the second layer; a gate electrode formed to oppose the lamination boundary; and a source electrode and a drain electrode, having the gate electrode interposed therebetween, each connected electrically to the second layer.
Public/Granted literature
- US20080315256A1 Nitride semiconductor device Public/Granted day:2008-12-25
Information query
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