Invention Grant
- Patent Title: Trench MOSFET with trench termination and manufacture thereof
- Patent Title (中): 具沟槽端接的沟槽MOSFET及其制造
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Application No.: US11862064Application Date: 2007-09-26
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Publication No.: US07750398B2Publication Date: 2010-07-06
- Inventor: Fwu-Iuan Hshieh
- Applicant: Fwu-Iuan Hshieh
- Applicant Address: CN Xu Hui District, Shanghai
- Assignee: Force-MOS Technology Corporation
- Current Assignee: Force-MOS Technology Corporation
- Current Assignee Address: CN Xu Hui District, Shanghai
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A trench MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) with a trench termination, including a substrate including a drain region which is strongly doped and a doping epi layer region, which is weekly doped the same type as the drain region, on the drain region; a plurality of source and body regions formed in the epi layer; a metal layer including a plurality of metal layer regions which are connected to respective source and body, and gate regions forming metal connections of the MOSFET; a plurality of metal contact plugs connected to respective metal layer regions; a plurality of gate trenches filled with polysilicon to form a plurality of trenched gates on top of epi layer; an insulating layer deposited on the epi layer formed underneath the metal layer with a plurality of metal contact holes therein for contacting respective source and body regions; a margin terminating gate trench which is around the gate trenches; and a margin terminating active region which is formed underneath the margin terminating gate trench.
Public/Granted literature
- US20090057756A1 Trench MOSFET with Trench Termination and manufacture thereof Public/Granted day:2009-03-05
Information query
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