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US07750405B2 Low-cost high-performance planar back-gate CMOS 有权
低成本高性能平面背栅CMOS CMOS

Low-cost high-performance planar back-gate CMOS
Abstract:
A method of fabricating a high-performance planar back-gate CMOS structure having superior short-channel characteristics and reduced capacitance using processing steps that are not too lengthy or costly is provided. Also provided is a high-performance planar back-gate CMOS structure that is formed utilizing the method of the present invention. The method includes forming an opening in an upper surface of a substrate. Thereafter, a dopant region is formed in the substrate through the opening. In accordance with the inventive method, the dopant region defines a back-gate conductor of the inventive structure. Next, a front gate conductor having at least a portion thereof is formed within the opening.
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