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Invention Grant
US07750454B2 Stacked integrated circuit package system 有权
堆叠式集成电路封装系统

Stacked integrated circuit package system
Abstract:
A stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer, and mounting a top integrated circuit package over the intermediate integrated circuit package.
Abstract(Chinese):

堆叠集成电路封装系统包括：提供具有其中具有空腔的基底封装的基底集成电路封装件和由所述腔体暴露的基底插入器; 在基底插入器上安装中间集成电路封装，并将顶部集成电路封装安装在中间集成电路封装上。

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