Invention Grant
US07750461B2 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
失效
用于电路或模块的金属陶瓷衬底，用于制造一个这种衬底的方法和包括一个这种衬底的模块
- Patent Title: Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
- Patent Title (中): 用于电路或模块的金属陶瓷衬底，用于制造一个这种衬底的方法和包括一个这种衬底的模块
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Application No.: US10515633Application Date: 2003-04-11
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Publication No.: US07750461B2Publication Date: 2010-07-06
- Inventor: Jürgen Schulz-Harder , Peter Haberl
- Applicant: Jürgen Schulz-Harder , Peter Haberl
- Applicant Address: DE Eschenback
- Assignee: Curamix Electronics GmbH
- Current Assignee: Curamix Electronics GmbH
- Current Assignee Address: DE Eschenback
- Agency: Hoffman Wasson & Gitler
- Priority: DE10227658 20020620
- International Application: PCT/DE03/01242 WO 20030411
- International Announcement: WO04/002204 WO 20031231
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/053
Abstract:
The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
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