A microelectronic assembly and a method of forming the assembly. The microelectronic assembly includes a package having a package substrate having a die side and a carrier side, and substrate lands on the carrier side thereof; a microelectronic die mounted on the package substrate at the die side thereof; and an array of first level interconnects electrically coupling the die to the package substrate. The assembly further includes a carrier having a substrate side, the package being mounted on the carrier at the substrate side thereof; and an array of second level interconnects electrically coupling the package to the carrier, each of the second level interconnects including a solder joint connecting the substrate lands to the carrier lands, and a crack arrester element at least partially encompassed within the solder joint.