Invention Grant
- Patent Title: Output stage for electronic devices integrated on a semiconductor substrate, in particular for high frequency applications and corresponding method
- Patent Title (中): 集成在半导体衬底上的电子器件的输出级,特别是用于高频应用和相应的方法
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Application No.: US11972234Application Date: 2008-01-10
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Publication No.: US07750690B2Publication Date: 2010-07-06
- Inventor: Paolo Pulici , Michele Bartolini , Pier Paolo Stoppino
- Applicant: Paolo Pulici , Michele Bartolini , Pier Paolo Stoppino
- Applicant Address: IT Agrate Brianza, MI IT Milan
- Assignee: STMicroelectronics S.R.L.,Politecnico di Milano
- Current Assignee: STMicroelectronics S.R.L.,Politecnico di Milano
- Current Assignee Address: IT Agrate Brianza, MI IT Milan
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Agent Lisa K. Jorgenson
- Priority: ITMI2007A0098 20070124
- Main IPC: H03B1/00
- IPC: H03B1/00 ; H03K3/00

Abstract:
An output stage may include an input terminal receiving an input signal, an output terminal coupled to an external load, and a pre-buffer coupled to the input terminal and including an enable terminal receiving a general enable signal and a first output terminal for supplying a first control signal. The output stage may also include an output buffer including a first final transistor inserted between the supply terminal and the output terminal, and a control terminal coupled to the first output terminal of the pre-buffer for receiving the first control signal, and a first tracking circuit between the supply terminal and the first output terminal of the pre-buffer. The first tracking circuit may include a first capacitor between the supply terminal and a first intermediate node coupled to the first output terminal of the pre-buffer by a switch activated by a first activation signal during a transient of the first final transistor thereby reconstructing a noise of the first reference voltage.
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