Invention Grant
US07750818B2 System and method for introducing a substrate into a process chamber 失效
将衬底引入处理室的系统和方法

  • Patent Title: System and method for introducing a substrate into a process chamber
  • Patent Title (中): 将衬底引入处理室的系统和方法
  • Application No.: US11874349
    Application Date: 2007-10-18
  • Publication No.: US07750818B2
    Publication Date: 2010-07-06
  • Inventor: In Taek Lee
  • Applicant: In Taek Lee
  • Applicant Address: KR Seongnam-si
  • Assignee: ADP Engineering Co., Ltd.
  • Current Assignee: ADP Engineering Co., Ltd.
  • Current Assignee Address: KR Seongnam-si
  • Agency: KED & Associates, LLP
  • Priority: KR10-2006-0118921 20061129; KR10-2006-0118922 20061129; KR10-2006-0118924 20061129
  • Main IPC: G08B21/00
  • IPC: G08B21/00
System and method for introducing a substrate into a process chamber
Abstract:
A system and method for introducing a substrate into a process chamber is provided. A presence or absence of a substrate on a stage in an apparatus for manufacturing a semiconductor or a flat panel display may be determined by lift pins used for loading and unloading a substrate, the introduction of another substrate may be prevented and a broken state or the erroneously loaded state of the substrate may be detected. An opening or closing of a gate valve may also be determined, and the introduction of a substrate into the process chamber may be prevented while the gate valve is closed.
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