Invention Grant
- Patent Title: System and method for introducing a substrate into a process chamber
- Patent Title (中): 将衬底引入处理室的系统和方法
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Application No.: US11874349Application Date: 2007-10-18
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Publication No.: US07750818B2Publication Date: 2010-07-06
- Inventor: In Taek Lee
- Applicant: In Taek Lee
- Applicant Address: KR Seongnam-si
- Assignee: ADP Engineering Co., Ltd.
- Current Assignee: ADP Engineering Co., Ltd.
- Current Assignee Address: KR Seongnam-si
- Agency: KED & Associates, LLP
- Priority: KR10-2006-0118921 20061129; KR10-2006-0118922 20061129; KR10-2006-0118924 20061129
- Main IPC: G08B21/00
- IPC: G08B21/00

Abstract:
A system and method for introducing a substrate into a process chamber is provided. A presence or absence of a substrate on a stage in an apparatus for manufacturing a semiconductor or a flat panel display may be determined by lift pins used for loading and unloading a substrate, the introduction of another substrate may be prevented and a broken state or the erroneously loaded state of the substrate may be detected. An opening or closing of a gate valve may also be determined, and the introduction of a substrate into the process chamber may be prevented while the gate valve is closed.
Public/Granted literature
- US20080124200A1 SYSTEM AND METHOD FOR INTRODUCING A SUBSTRATE INTO A PROCESS CHAMBER Public/Granted day:2008-05-29
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