Invention Grant
US07751046B2 Methods and systems for determining a critical dimension and overlay of a specimen
有权
用于确定试样的临界尺寸和覆盖层的方法和系统
- Patent Title: Methods and systems for determining a critical dimension and overlay of a specimen
- Patent Title (中): 用于确定试样的临界尺寸和覆盖层的方法和系统
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Application No.: US10401242Application Date: 2003-03-27
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Publication No.: US07751046B2Publication Date: 2010-07-06
- Inventor: Ady Levy , Kyle A. Brown , Rodney Smedt , Gary Bultman , Mehrdad Nikoonahad , Dan Wack , John Fielden , Ibrahim Abdulhalim
- Applicant: Ady Levy , Kyle A. Brown , Rodney Smedt , Gary Bultman , Mehrdad Nikoonahad , Dan Wack , John Fielden , Ibrahim Abdulhalim
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corp.
- Current Assignee: KLA-Tencor Technologies Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G01B11/00
- IPC: G01B11/00 ; G01N21/00 ; G01B11/30 ; G01B11/14 ; G01B11/02
Abstract:
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Public/Granted literature
- US20040235205A1 Methods and systems for determining a critical dimension and overlay of a specimen Public/Granted day:2004-11-25
Information query
