Invention Grant
US07751156B2 Dual-layer free layer in a tunneling magnetoresistance (TMR) element
有权
隧道磁阻(TMR)元件中的双层自由层
- Patent Title: Dual-layer free layer in a tunneling magnetoresistance (TMR) element
- Patent Title (中): 隧道磁阻(TMR)元件中的双层自由层
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Application No.: US11536891Application Date: 2006-09-29
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Publication No.: US07751156B2Publication Date: 2010-07-06
- Inventor: Daniele Mauri , Satoshi Shigematsu , Alexander M. Zeltser
- Applicant: Daniele Mauri , Satoshi Shigematsu , Alexander M. Zeltser
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Duft Bornsen & Fishman, LLP
- Main IPC: G11B5/39
- IPC: G11B5/39

Abstract:
Tunneling magnetoresistive (TMR) elements and associated methods of fabrication are disclosed. In one embodiment, the TMR element includes a ferromagnetic pinned layer structure, a tunnel barrier layer, and a free layer having a dual-layer structure. In one embodiment, the free layer includes a first amorphous free layer and a second amorphous free layer. In another embodiment, the free layer includes a first polycrystalline free layer and a second amorphous free layer. The compositions of the first free layer and the second free layer of the dual layer structure differ to provide improved TMR performance and controlled magnetostriction. In one example, the first free layer may have a composition optimized for TMR while the second free layer may have a composition optimized for magnetostriction.
Public/Granted literature
- US20080080101A1 DUAL-LAYER FREE LAYER IN A TUNNELING MAGNETORESISTANCE (TMR) ELEMENT Public/Granted day:2008-04-03
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