Invention Grant
- Patent Title: Chassis having a bypass channel for air flow
- Patent Title (中): 底盘具有用于气流的旁路通道
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Application No.: US11926890Application Date: 2007-10-29
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Publication No.: US07751186B2Publication Date: 2010-07-06
- Inventor: David L. Moss , Paul T. Artman , William Coxe , Shawn P. Hoss
- Applicant: David L. Moss , Paul T. Artman , William Coxe , Shawn P. Hoss
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Baker Botts L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; G06F1/20

Abstract:
A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.
Public/Granted literature
- US20090109612A1 Chassis Having a Bypass Channel for Air Flow Public/Granted day:2009-04-30
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