Invention Grant
- Patent Title: Cooling arrangement to cool components on circuit board
- Patent Title (中): 冷却电路板组件冷却
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Application No.: US11852158Application Date: 2007-09-07
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Publication No.: US07751189B2Publication Date: 2010-07-06
- Inventor: Sandeep Ahuja , Ioan Sauciuc
- Applicant: Sandeep Ahuja , Ioan Sauciuc
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.
Public/Granted literature
- US20090080156A1 Cooling Arrangement to Cool Components on Circuit Board Public/Granted day:2009-03-26
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