Invention Grant
- Patent Title: Semiconductor laser having protruding portion
- Patent Title (中): 半导体激光器具有突出部分
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Application No.: US11770633Application Date: 2007-06-28
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Publication No.: US07751454B2Publication Date: 2010-07-06
- Inventor: Akinori Yoneda
- Applicant: Akinori Yoneda
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2003-354220 20031014; JP2004-299092 20041013
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A semiconductor laser device including: semiconductor layers including an n-type semiconductor layer, an active layer and a p-type semiconductor layer, the semiconductor layers having a stripe-shaped waveguide region formed therein; end face protective film formed on the end face of the semiconductor layer that is substantially perpendicular to the waveguide region; wherein a p-side protruding portion is formed in the vicinity of the end portion of a p-electrode or n-electrode.
Public/Granted literature
- US20080017868A1 SEMICONDUCTOR LASER HAVING PROTRUDING PORTION Public/Granted day:2008-01-24
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