Invention Grant
- Patent Title: Measurement method of layer thickness for thin film stacks
- Patent Title (中): 薄膜叠层厚度测量方法
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Application No.: US12292178Application Date: 2008-11-13
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Publication No.: US07751527B2Publication Date: 2010-07-06
- Inventor: Kazuhiro Ueda , Akio Yoneyama
- Applicant: Kazuhiro Ueda , Akio Yoneyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Main IPC: G03H5/00
- IPC: G03H5/00

Abstract:
Provided is a thin film stack inspection method capable of accurately measuring and inspecting layer thicknesses of thin film stacks. An X-ray having a long coherence length is used as an incident X-ray and the X-ray specular-reflected from a sample placed on a goniometer is partially bent by a prism. The X-ray bent by the prism and the X-ray going straight are made to interfere with each other to obtain interference patterns. Though being thin film stacks, the sample has a portion having no thin film and thus an exposed substrate. The X-ray not bent by the prism includes an X-ray specular-reflected from the exposed substrate. By changing the incident angle from 0.01° to 1°, the interference patterns of the specular-reflected X-ray are measured. Thus, layer thicknesses are measured using a change in a phase of the X-ray reflected from a film stack interface.
Public/Granted literature
- US20090180588A1 Measurement method of layer thickness for thin film stacks Public/Granted day:2009-07-16
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