Invention Grant
- Patent Title: Method and system for thermal process control
- Patent Title (中): 热过程控制方法和系统
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Application No.: US11001767Application Date: 2004-12-02
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Publication No.: US07751908B2Publication Date: 2010-07-06
- Inventor: Yung-Chih Chang , Cheng-I Sun , Chun-I Kuo , Fu-Kun Yeh , Hsueh-Chi Shen
- Applicant: Yung-Chih Chang , Cheng-I Sun , Chun-I Kuo , Fu-Kun Yeh , Hsueh-Chi Shen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05D7/00

Abstract:
A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.
Public/Granted literature
- US20060122728A1 Method and system for thermal process control Public/Granted day:2006-06-08
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