Invention Grant
- Patent Title: Semiconductor manufacturing apparatus and manufacturing of a semiconductor device
- Patent Title (中): 半导体制造装置和半导体装置的制造
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Application No.: US11662631Application Date: 2005-10-03
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Publication No.: US07751922B2Publication Date: 2010-07-06
- Inventor: Makoto Hirano , Norichika Yamagishi , Akihiro Yoshida
- Applicant: Makoto Hirano , Norichika Yamagishi , Akihiro Yoshida
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2004-293244 20041006
- International Application: PCT/JP2005/018283 WO 20051003
- International Announcement: WO2006/038584 WO 20060413
- Main IPC: G06F19/00
- IPC: G06F19/00 ; H01L21/68

Abstract:
A processing furnace for performing prescribed heat treatment on plural substrates, a boat for carrying the plural substrates that are laid one over another in the boat into and out of the processing furnace, a substrate detecting sensor for detecting the plural substrates laid one over another in the boat by changing a relative position of the substrate detecting sensor with respect to each of the plural substrates, and a control section for registering reference positions of the plural substrates and an allowable range of positional deviations from the reference positions of the plural substrates are provided. The control section receives pieces of position information of the plural substrates measured by the substrate detecting sensor, compares a maximum value of pieces of position information of substrates with an average thereof and compares a minimum value of pieces of position information of substrates with an average thereof if the pieces of position information of the plural substrates are out of the allowable range of positional deviations from the reference positions of the plural substrates, and judges that deviation has occurred in a boat stop position if differences determined by the respective comparisons are within the allowable range of deviations of the substrates.
Public/Granted literature
- US20080127467A1 Semiconductor Manufacturing Apparatus and Manufacturing of a Semiconductor Device Public/Granted day:2008-06-05
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