Invention Grant
- Patent Title: Test device and method for circuit device and manufacturing method for the same
- Patent Title (中): 电路装置的测试装置及方法及其制造方法
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Application No.: US11528530Application Date: 2006-09-28
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Publication No.: US07752517B2Publication Date: 2010-07-06
- Inventor: Takeshi Onodera
- Applicant: Takeshi Onodera
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JPP2005-292421 20051005
- Main IPC: G05B11/01
- IPC: G05B11/01 ; G01R27/28 ; G01R31/28 ; G01R31/26

Abstract:
A test device that makes a test of a circuit device including a plurality of modules being substitutable in terms of function for one another, and in which a function change can be made for assignment to each of the modules based on an incoming control signal. The test device includes: a control section that generates the control signal, without changing a function to be assigned to a whole of the modules, to make the function change for assignment to each of the modules at least in a group of the modules; and a determination section that detects whether the circuit device operates differently when the function change is made for assignment to the modules, and based on a detection result, determines whether or not at least the group of the modules includes a defective module.
Public/Granted literature
- US20070088996A1 Test device and method for circuit device and manufacturing method for the same Public/Granted day:2007-04-19
Information query