In a method of partially attaching an additional attaching material for various types of printed circuit boards, the method attaches an additional attaching material partially onto circuit blocks after circuits of the circuit blocks are made on a flexible, rigid or mixed printed circuit board or an insulating layer is coated. The method sets an attaching material on a shaping material that covers the circuit blocks, uses a depth control tool to cut away areas not corresponding to those requiring to be attached onto the necessary circuit blocks, aligns the corresponding positions of the circuit blocks to perform pseudo attachment and pressing, and tears away the shaping material from the attaching material, so as to attach additional attaching materials properly onto the predetermined positions of the circuit blocks without requiring to attach the circuit blocks one by one, and achieve the effect of saving manufacturing time and avoiding misalignment.