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US07752751B2 System and method of forming a low profile conformal shield 有权
形成薄型共形屏蔽的系统和方法

System and method of forming a low profile conformal shield
Abstract:
A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.
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