Invention Grant
- Patent Title: System and method of forming a low profile conformal shield
- Patent Title (中): 形成薄型共形屏蔽的系统和方法
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Application No.: US12058912Application Date: 2008-03-31
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Publication No.: US07752751B2Publication Date: 2010-07-13
- Inventor: Christopher James Kapusta , Donald Cunningham , Richard Joseph Saia
- Applicant: Christopher James Kapusta , Donald Cunningham , Richard Joseph Saia
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Agent Jean K. Testa
- Main IPC: H01K3/10
- IPC: H01K3/10

Abstract:
A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.
Public/Granted literature
- US20090242263A1 SYSTEM AND METHOD OF FORMING A LOW PROFILE CONFORMAL SHIELD Public/Granted day:2009-10-01
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