Invention Grant
- Patent Title: Cutting device with multiple cutting structures
- Patent Title (中): 具有多个切割结构的切割装置
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Application No.: US11175567Application Date: 2005-07-06
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Publication No.: US07753139B2Publication Date: 2010-07-13
- Inventor: Charles H. Dewey , Praful C. Desai
- Applicant: Charles H. Dewey , Praful C. Desai
- Applicant Address: US TX Houston
- Assignee: Smith International, Inc.
- Current Assignee: Smith International, Inc.
- Current Assignee Address: US TX Houston
- Agency: Conley Rose, P.C.
- Main IPC: E21B7/04
- IPC: E21B7/04

Abstract:
A cutting device for downhole operations comprises a first cutting structure, and a second cutting structure, wherein at least the second cutting structure is selectively presentable for operation. A method of performing a downhole cutting operation comprises running into a well bore a cutting device comprising a plurality of cutting structures, performing a first cutting operation with a first cutting structure of the cutting device, selectively presenting a second cutting structure of the cutting device, and performing a second cutting operation with at least the second cutting structure. The method may further comprise aligning the cutting device to allow the second cutting structure to be selectively presented.
Public/Granted literature
- US20070007043A1 Cutting device with multiple cutting structures Public/Granted day:2007-01-11
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