Invention Grant
- Patent Title: Electrical contact with C-shaped spring portion interconnecting upper contacting arm portion and lower soldering leg
- Patent Title (中): 与连接上接触臂部分和下焊道的C形弹簧部分电接触
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Application No.: US12154305Application Date: 2008-05-22
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Publication No.: US07753704B2Publication Date: 2010-07-13
- Inventor: Ming-Yue Chen
- Applicant: Ming-Yue Chen
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: CN200720037867 20070522
- Main IPC: H01R11/22
- IPC: H01R11/22
Abstract:
An electrical contact (5) adapted for connection a BGA device to a PCB includes a pair of arm portions defining a pair of clamping portions (51, 52) at top ends thereof for corresponding solder balls of the BGA device, a C-shaped spring portion (53) extending from a bottom end of one arm portion (51) and a contacting portion (54) extending from a free end of the spring portion for touch the PCB. The spring portion opens perpendicularly to the arm portions.
Public/Granted literature
- US20080293279A1 Electrical connector having improved contacts Public/Granted day:2008-11-27
Information query
