Invention Grant
- Patent Title: Electrical interconnection systems and methods of assembling the same
- Patent Title (中): 电气互连系统及其组装方法
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Application No.: US12200629Application Date: 2008-08-28
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Publication No.: US07753741B2Publication Date: 2010-07-13
- Inventor: John D. Bloomfield
- Applicant: John D. Bloomfield
- Applicant Address: US CT Wallingford
- Assignee: Times Microwave Systems, Inc.
- Current Assignee: Times Microwave Systems, Inc.
- Current Assignee Address: US CT Wallingford
- Agency: Blank Rome LLP
- Main IPC: H01R13/428
- IPC: H01R13/428

Abstract:
An electrical interconnection system is described. The electrical interconnection system comprises a first contact and a second contact configured to electrically couple together. The system also comprises a receptacle assembly including a receptacle shell and a first retaining ring secured within the receptacle shell. The receptacle assembly is configured to couple the first contact to the receptacle shell. The system further comprises a plug assembly including a plug shell and a second retaining ring secured within the plug shell. The plug assembly is configured to couple the second contact to the plug shell. The receptacle shell and the plug shell are further configured to align the first contact and the second contact for coupling together.
Public/Granted literature
- US20090269957A1 ELECTRICAL INTERCONNECTION SYSTEMS AND METHODS OF ASSEMBLING THE SAME Public/Granted day:2009-10-29
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