Invention Grant
US07753888B2 Method and/or apparatus for puncturing a surface for extraction, in situ analysis, and/or substance delivery using microneedles
有权
用于使用微针刺穿表面用于提取，原位分析和/或物质递送的方法和/或设备
- Patent Title: Method and/or apparatus for puncturing a surface for extraction, in situ analysis, and/or substance delivery using microneedles
- Patent Title (中): 用于使用微针刺穿表面用于提取，原位分析和/或物质递送的方法和/或设备
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Application No.: US10995570Application Date: 2004-11-22
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Publication No.: US07753888B2Publication Date: 2010-07-13
- Inventor: Erik V. Mukerjee , Rosemary L. Smith
- Applicant: Erik V. Mukerjee , Rosemary L. Smith
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Agency: Quine Intellectual Property Law Group
- Agent Stephen J. LeBlanc
- Main IPC: A61M5/00
- IPC: A61M5/00
Abstract:
A method and apparatus for puncturing a surface for extraction, in situ monitoring, and/or substance delivery uses microneedles with improved properties. Applications include easy to handle glucose monitoring using a group of hollow out-of-plane silicon microneedles to sample substances in interstitial fluid from the epidermal skin layer.
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