Invention Grant
- Patent Title: Coating composition and low dielectric siliceous material produced by using same
- Patent Title (中): 涂料组合物和使用相同的低介电硅质材料
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Application No.: US10565429Application Date: 2004-08-04
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Publication No.: US07754003B2Publication Date: 2010-07-13
- Inventor: Tomoko Aoki , Hiroyuki Aoki
- Applicant: Tomoko Aoki , Hiroyuki Aoki
- Applicant Address: US NJ Somerville
- Assignee: AZ Electronic Materials USA Corp.
- Current Assignee: AZ Electronic Materials USA Corp.
- Current Assignee Address: US NJ Somerville
- Agent Alan Kass; Sangya Jain
- Priority: JP2003-292529 20030812
- International Application: PCT/JP2004/011135 WO 20040804
- International Announcement: WO2005/014743 WO 20050217
- Main IPC: C09D183/00
- IPC: C09D183/00 ; B32B9/00
Abstract:
The present invention provides a coating composition, which can simply produce a porous siliceous film having excellent mechanical strength and, at the same time, possessing a stable very low level of dielectric and good chemical resistance to various chemicals, and to provide a process for producing a siliceous material using the same. The coating composition according to the present invention comprises a polyalkylsilazane compound, an acetoxysilane compound, an organic solvent, and, if necessary, a pore forming material. The present invention also provides a siliceous material produced by firing the coating composition and a process for producing the same.
Public/Granted literature
- US20060246303A1 Coating composition and low dielectric siliceous material produced by using same Public/Granted day:2006-11-02
Information query
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