Invention Grant
- Patent Title: Chemical-mechanical polishing composition and method for using the same
- Patent Title (中): 化学机械抛光组合物及其使用方法
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Application No.: US10568727Application Date: 2004-09-10
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Publication No.: US07754098B2Publication Date: 2010-07-13
- Inventor: David J. Schroeder , Kevin J. Moeggenborg
- Applicant: David J. Schroeder , Kevin J. Moeggenborg
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas E. Omholt; Steven D. Weseman
- International Application: PCT/US2004/029710 WO 20040910
- International Announcement: WO2005/026277 WO 20050324
- Main IPC: C09K13/00
- IPC: C09K13/00

Abstract:
The invention provides a chemical-mechanical polishing composition comprising: (a) silica particles, (b) about 5×10−3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, (c) about 0.1 to about 15 wt. % of an oxidizing agent, and (d) a liquid carrier comprising water. The invention also provides a polishing composition, which optionally comprises an oxidizing agent, comprising about 5×10−3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, and mixtures thereof. The invention further provides methods for polishing a substrate using the aforementioned polishing compositions.
Public/Granted literature
- US20080057832A1 Chemical-Mechanical Polishing Composition and Method for Using the Same Public/Granted day:2008-03-06
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