Invention Grant
US07754108B2 Polyimide powder for antistatic polyimide molded product and polyimide molded product thereby
失效
因此，用于抗静电聚酰亚胺模塑产品的聚酰亚胺粉末和聚酰亚胺模制产品
- Patent Title: Polyimide powder for antistatic polyimide molded product and polyimide molded product thereby
- Patent Title (中): 因此，用于抗静电聚酰亚胺模塑产品的聚酰亚胺粉末和聚酰亚胺模制产品
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Application No.: US11422850Application Date: 2006-06-07
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Publication No.: US07754108B2Publication Date: 2010-07-13
- Inventor: Hideki Ozawa , Fumio Aoki
- Applicant: Hideki Ozawa , Fumio Aoki
- Applicant Address: JP Yamaguchi
- Assignee: Ube Industires, Ltd.
- Current Assignee: Ube Industires, Ltd.
- Current Assignee Address: JP Yamaguchi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2005-168234 20050608
- Main IPC: H01B1/06
- IPC: H01B1/06 ; B60C1/00 ; C04B35/00
Abstract:
A polyimide powder for an antistatic polyimide molded product is disclosed. The polyimide powder comprises a polyimide-powder prepared from an aromatic tetracarboxylic acid component and a diamine component, and a conductive carbon black having a DBP oil absorption of 300 ml/100 g or more; wherein the amount of the conductive carbon black is within a range of 0.75 wt % to 5 wt % relative to the polyimide-powder. A polyimide molded product with sufficient antistatic property can be formed by molding the above polyimide powder.
Public/Granted literature
- US20060199895A1 POLYIMIDE POWDER FOR ANTISTATIC POLYIMIDE MOLDED PRODUCT AND POLYIMIDE MOLDED PRODUCT THEREBY Public/Granted day:2006-09-07
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